Quantum Chip Fabrication Researcher

Responsibilities

1. Process Operation and Execution: Independently operate and maintain a range of semiconductor and quantum chip fabrication equipment in a cleanroom environment, including but not limited to:

   1. Lithography systems (e.g., electron beam lithography, UV photolithography)

   2. Thin film deposition systems (e.g., e-beam evaporation, magnetron sputtering)

   3. Etching systems (e.g., dry etching, wet etching)

   4. Atomic Layer Deposition (ALD) systems

   5. Wafer cleaning and inspection equipment

2. Process Flow Execution: Follow standard operating procedures (SOPs) to carry out full or partial fabrication processes for superconducting quantum chips, including key steps such as substrate cleaning, electrode fabrication, Josephson junction fabrication, dielectric deposition, and interconnect formation.

3. Process Monitoring and Quality Control: Establish and maintain process monitoring protocols; perform preliminary inspections at each fabrication step (e.g., optical microscopy, profilometry, electrical testing); record key process parameters to ensure consistency and reproducibility.

4. Data Recording and Analysis: Accurately document experimental data, process parameters, and observations; assist engineers with data analysis and preliminary troubleshooting.

5. Equipment Maintenance: Conduct routine inspection, cleaning, and basic maintenance of fabrication equipment to ensure optimal performance and maintain cleanroom standards.

6. Collaboration and Communication: Work closely with chip design and testing teams; provide feedback on fabrication processes, jointly analyze performance issues, and contribute to iterative process optimization.

Requirements

1. Education and Background: Ph.D. in Microelectronics, Electronic Science and Technology, Materials Science and Engineering, Physics (preferably condensed matter physics or optics), Precision Instrumentation, or related fields.

2. Fundamental Knowledge:

   1. Solid foundation in semiconductor physics, solid-state physics, and materials science.

   2. Understanding of fundamental semiconductor fabrication processes (e.g., lithography, etching, deposition).

3. Hands-on Skills and Learning Ability:

   1. Strong experimental and hands-on skills, demonstrated through laboratory work, thesis projects, or practical experience.

   2. Proven ability to quickly learn and operate new equipment and processes.

   3. Experience in micro/nanofabrication; ability to independently operate key equipment (lithography, deposition, etching); capability in process integration is a plus.

4. Personal Attributes:

   1. High level of responsibility, attention to detail, and patience; strict adherence to cleanroom protocols and procedures.

   2. Strong teamwork and communication skills.

   3. Good analytical thinking and problem-solving mindset, with a strong interest in technical details.